he most recent research study from SkyQuest gives a thorough overview of the IC packaging market and delves deeply into the production, distribution, and supply chain. Additionally, the study provides information on significant players in the sector and aids in the understanding of market trends and opportunities by stakeholders. The study's insightful facts and analysis will help stakeholders make wise decisions and create winning business plans.

Westford, USA, Feb. 20, 2023 (GLOBE NEWSWIRE) -- It is anticipated that the Asia-Pacific region will control more than 90% of the IC packaging market. The existence of important IC packaging and assembly companies in the area is a key factor in the market's regional expansion. Vertically stacked electronic components and integrated circuits (ICs) are becoming increasingly popular in the expanding nanoelectronics and semiconductor sector. These ICs offer excellent performance, expanded functionality, and lower power consumption to meet the needs of electronic devices. the growing demand for advanced architecture in electronic items, including linked gadgets, tablets, and smartphones, in order to improve their power efficiency and ability to do more than just text and talk. These elements are anticipated to support the market for IC packaging in its expansion.

SkyQuest found during research that the drivers boosting the development of 3D IC packaging in the IT and telecommunications sector include the rising investment in 5G infrastructure, the rising number of data center servers, along with IoT connectivity and networking devices. Also noted that the mobile service providers in Korea like KT, LG Uplus, and SK Telecom have promised to spend a combined KRW 25.7 trillion during 2022 to fund 5G infrastructure throughout the nation. With the increased expenditure, Seoul and six other cities' 5G quality will be improved.